Eugene J. Rymaszewski

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Thin-Film Capacitors for Packaged Electronics

by Pushkar Jain and Eugene J. Rymaszewski First published in 2003 — 4 editions

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Microelectronics Packaging Handbook, Part III: Subsystem Packaging (Microelectronics Packaging Handbook)

by R.R. Tummala, Eugene J. Rymaszewski, and Alan G. Klopfenstein First published in 1997 — 4 editions

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Microelectronics Packaging Handbook, Vol.s 1-3: CD-ROM, Second Edition

by R.R. Tummala, Eugene J. Rymaszewski, and Alan G. Klopfenstein First published in 1997 — 3 editions

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Second Level Microelect Packaging

by Rao Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein, Richard Bottoms, Kay, and Linee Moore First published in 2001 — 1 edition

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Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging

by R.R. Tummala, Eugene J. Rymaszewski, and Alan G. Klopfenstein First published in 1997 — 1 edition

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Microelectronics Packaging Fund

by Rao R. Tummala, Eugene J. Rymaszewski, and Alan G. Klopfenstein First published in 2001 — 1 edition

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Microelectronics packaging handbook

by Rao R. Tummala and Eugene J. Rymaszewski First published in 1989 — 1 edition
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OLID: OL2692188A

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Created April 29, 2008
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April 29, 2008

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Eugene J. Rymaszewski

7 works Add another?

Thin-Film Capacitors for Packaged Electronics

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Microelectronics Packaging Handbook, Part III: Subsystem Packaging (Microelectronics Packaging Handbook)

Microelectronics Packaging Handbook, Vol.s 1-3: CD-ROM, Second Edition

Second Level Microelect Packaging

Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging

Microelectronics Packaging Fund

Microelectronics packaging handbook

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