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International Workshop on Stress Management for 3D ICs Using Through Silicon Vias (2010 Albany, N.Y.)

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Stress management for 3D ICs using through silicon vias: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias, Albany, NY, U.S.A, March 16, 2010, San Francisco, CA, U.S.A., July 13, 2010, Dresden, Germany, October 20, 2010

by International Workshop on Stress Managem... First published in 2011 — 1 edition

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Created March 23, 2012
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