An edition of Modeling and Application of Flexible Electronics Packaging (2019)

Modeling and Application of Flexible Electronics Packaging

by , , and

Cover of: Modeling and Application of Flexible Electronics Packaging by YongAn Huang, Zhouping Yin, Xiaodong Wan, YongAn Huang, Zhouping Yin, Xiaodong Wan
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Last edited by ImportBot
December 5, 2019 | History
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An edition of Modeling and Application of Flexible Electronics Packaging (2019)

Modeling and Application of Flexible Electronics Packaging

by , , and

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Publish Date
Publisher
Springer
Pages
287

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Edition Availability
Cover of: Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
Apr 24, 2019, Springer
hardcover

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Book Details

Classifications

Library of Congress
TA1-2040

The Physical Object

Format
hardcover
Number of pages
287

Edition Identifiers

Open Library
OL27745671M
ISBN 10
9811336261
ISBN 13
9789811336263
Amazon ID (ASIN)
9811336261

Work Identifiers

Work ID
OL20510402W

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December 5, 2019 Created by ImportBot import new book