Characterization of Integrated Circuit Packaging Materials

Characterization of Integrated Circuit Packag ...
Thomas Moore, Thomas Moore
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June 18, 2022 | History

Characterization of Integrated Circuit Packaging Materials

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Publish Date
Publisher
Momentum Press
Language
English

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Book Details


The Physical Object

Pagination
274

Edition Identifiers

Open Library
OL38351027M
ISBN 13
9781606501894

Work Identifiers

Work ID
OL28031462W

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June 18, 2022 Created by ImportBot import new book